IPHONE SPECIAL TOOLS, RELIFE, SOLDERING RELATED PRODUCTS
RELIFE CPU SOLDERING PASTE SP-50Rated 0 out of 5(0)
- Name: CPU SOLDER PASTE
- Model: SP-50
- Weight: 50g
- 158 degree ,Customized for BGA IC welding .
- Soldering joint bright ,full Wuxi beats , moderate viscosity
- After welding ,less residue ,appearance ?and transparency ,high insulation resistance .
- Has good wettability ,excellent welding
Universal liquic for frame RL-518 (Relife)Rated 0 out of 5(0)
- Name: Universal liquic for frame
- Model: RL-518
- Suitable for many model China mobile ,for example R7/R7S/R7P/R9/R9P/R11/R11P/X6/X7/X7P/X9/X9SP/X20 etc.
- Special effects on the PUR ,suitable for IP Xr/Xs/X/8/8P
- The effect is significant, just a little can be effective, saving cost and time
- No hurt the flex cable ,no hurt the Lcd ,no hurt the frame.
NOTE- Courier charge will be equivalent to weight 5kg if liquid products are ordered.SKU: n/a
PRECISION BGA STENCILS RL-044 SAM6Rated 0 out of 5(0)
- Name: PRECISION BGA STENCILS
- Model: RL-044 SAM6
- Pioneering half etching process,let some components fit into the groove Protect components to avoid burns.
- Cooling hole patented design,rapid heat dissipation to avoid damage to components due to excessive temperature.
- Ultra-precise round square hole positioning,precision of hole,Round square hole design,Easy to take off the steel,Make the operation more smooth.
- Double blister packaging，hard paper package ,protect the steel mesh from being crushed and deformed during transportation.
RELIFE, SOLDERING RELATED PRODUCTS
RL-2015 SOLDERING WICKRated 0 out of 5(0)
- Its emergence greatly reduces the time for rework/repair of electronic products and greatly reduces the risk of thermal damage to the board.
- Imported pure copper material special chemical formula,efficient tin removal
- Unique weaving process,copper-absorbing effect and just use a little can remove more solder.